Variable focus capability of the optics allows the user to image from first to up to 20 rows of BGA solder bumps with its flexible, electronically dimmable fibre brush light as background illumination.
The unique soft-touch mechanism design in the stand bracket protects the micro-prisms in the optical probe tip from damage when positioned on surface of the inspection PCB. 180º pivoting mechanism for easy alignment of the probe along 3 different sides of the BGA package.
INSPECTIS© BGA Inspection software is designed to help users navigate effortlessly. With a logical layout and graphical icons for each function, operators can quickly become familiar with the software, saving time during inspection and measurement routines and reducing the need for training sessions.
Thanks to its interchangeable Side-view and Top-view optics the Inspectis BGA system provides a flexible and versatile inspection solution for efficient use of investment budget.
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