Inspect-X has been designed around the user experience, resulting in intuitive and productive X-ray inspection. Inspect-X features user friendly wizards to guide users through complex inspections, as well as utilizing the most advanced visualization and analysis function capabilities. XT V systems with Inspect-X enable rapid deployment of new product lines, within minutes, rather than hours or days.
C.Clear intelligently adapts to changing X-ray conditions and sample positions, automatically adjusting image controls, contrast and brightness in
order to provide the clearest and sharpest images to aid in defect recognition. Real-time enhancements and filters can be chosen and stored as user profiles to suit different sample types or individual operator preferences.
With C.Clear, operators can make fast and well-informed decisions, enabling defects to be detected correctly first time, especially for hard to detect faults within multi-tier BGA or complex bond wires. The C.Clear imaging engine enables manufacturers to increase inspection throughput and to reduce false call rates, leading to improved quality and efficiency.
The new BGA tool provides powerful image processing, fully automated analysis and detailed reporting to inspect complex packages such as Package on Package (PoP) or dual-layered boards. With its powerful image processing algorithm, the tool gives accurate results even in complex board assemblies with underside components. The tool allows creation of an internal library of bGA templates using a wizard or via file import to reduce the time taken to build automated pass/fail inspection routines.
The BGA device inspection functionality is an ‘all-in-one’ tool offering automatic analysis of:
BGA template definition wizard Report indicating BGA voids that are in or out of tolerance
Featuring high magnification and (sub)micron feature detection, the XT V platforms equipped with Inspect-X are a powerful tool for advanced bond wire inspection. The new automated multi-bond wire tool provides repeatable inspection with the highest accuracy.
Inspect-X provides a suite of easy-to-use tools and customizable HTML templates for endless real-time or automated reporting possibilities. Reports can be easily shared with colleagues or suppliers to facilitate decision-making. Results are available for offline analysis and troubleshooting on validation station.
Operating in automated inspection mode, the XT V combined with Inspect-X is a productive X-ray solution for repeated inspection of PCBAs, 
semiconductor components and complex high density boards. Creation and execution of inspection routines is straightforward, utilizing the graphical interface or teach and learn.
Users requiring detailed insight of (multi-layer) electronic components can benefit from the optional Computed Tomography functionality for a full 3D view of internal structure.
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